CoorsTek chip trays are used mainly to store and transport large semiconductor packages, including Quad Flat Pack (QFP), Pin Grid Array (PGA) and Ball Grid Array (BGA).
CoorsTek manufactures two types of JEDEC-compliant matrix trays:

• High-temperature trays capable of withstanding temperatures up to 240°Celsius
• Mid-temperature trays for baking temperatures from 125 to 180°Celsius.

CoorsTek provides extensive custom tray design and tooling capability with a complete in-house design and tooling fabrication staff.

Our specialty relates to trays manufactured from advanced materials that improve the dimensional stability and thermodynamic performance of the JEDEC trays.
CoorsTek trays withstand higher baking temperatures for long periods resulting in substantially improved tray life and manufacturing productivity.

Also, our chip trays are manufactured in the US (Austin, TX). We are highly cost competitive by use of state-of-the-art automation. Package styles available include: BGA, QFP, TQFP, LQFP, PQFP, TSOP, and PGA.