• A versatile machine for fast, accurate placement of components ranging from 0603 (0201) microchips to 55mm AFPs, CSPs, BGAs, 150-mm long, 25-mm wide and 25-mm high connectors.
  
• The recongnition speed of 2D and 3D sensors has been doubled compared with the MPAV2.
  Vertical bending of all pins of QFPs, presence of balls of CSPs and BGAs, position and the height of a minute solder bump can be detected using the 3D sensor.
  
• The high-speed tray supplier allows high-speed placement of tray-supplied, irregularly- shaped components such as large connectors, QFPs and SOPs.
• The tray supplier combines direct pickup and shuttle supply achieving excellent throughtput and component versatility. 2 units of the tray supplier can be set up.
• Pressure control of up to 0.1N. Pressured insertion of connectors up to 50N is possible with the 10-nozzle head. *Option
  
  
  

Industry's top-level^* productivity

• The high-speed placement at 0.094 s/piece is made possible by the 10-nozzle head system, dual table and high-speed 2D sensor.
  10-nozzle head : Enables gang pickup.
  Dual table : Minimizes the distance of head movement.
• Space saving design of machine width 1,720mm. (excluding the tray supplier)

Uninterrupted operation

• Tray suppliers component size 48 types (96 types 2 units installed) can also be added to the mazimum component inputs of 192(using the double feeder).
• The motorized feeder^* (excluding the 8-mm type) allows the feed quantity to be switched, so the types of component feeders required are signigicantly reduced.
• Use of the tape joining and automatic tray coponent replacement function enables component replenishment during operation, thereby ensuring uninterrupted operation.
• Two trays per plate and a total of 96 trays can be installed.
• The cart for gang exchange gang exchange^* support plate all contribute to speedy procuction changeover.