1. As epoxy coupling agent, it is used in polysulfide-based and metal-filled epoxide resinous material.
2. Improve the adhesion between inorganic stuffing, substrate material and resin, accordingly improve electrical property of electronic material which is made of epoxy resin and wrappage. 
3. It can be widely used in multi-fillers and substrates such as clay, talcum, tricalcium silicate, silica, quartz, aluminum, copper and iron. Including quartz-filled epoxy sealants, grail-filled epoxy resin and concrete patching material or coating,  toner of modeling kits, and improving the dispersivity, fluidity of adhesive.
4. To avoid the need of independent primer in polysulfide and polyurethane sealant and sealing compounds.
5. Improve the adhesion of double-component epoxy sealing agent, It is used in polyurethane adhesive and sealant, epoxy resin adhesives, enhanced thermosetting resin, glass fiber adhesive, thermoplastic resin for inorganic filler or glass reinforcement.