KB10473-FLAO

KB10473-FLAO


Negotiable Min Order Quantity Unit

Required Quantity
Place of Origin
India
Payment Terms
T/T
Production method
Negotiable
Shipping / Lead Time
Negotiable / Negotiable
Keyword
nasa low outgassing, two component epoxy, electrically isolating, high elongation
Category
Epoxy Adhesives
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Kohesi Bond

Membership
BIZ
Country / Year Established
India India / 2015
Business type
Manufacturer
Verified Certificate

7

Product name KB10473-FLAO Certification -
Category Epoxy Adhesives Ingredients -
Keyword nasa low outgassing , two component epoxy , electrically isolating , high elongation Unit Size -
Brand name - Unit Weigh -
origin India Stock -
Supply type - HS code -

Product Information

Kohesi Bond KB 10473 FLAO is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours.

KB 10473 FLAO is thermally conductive and offers top notch conductivity of 1.4 – 1.5 W/m/K. It is cryogenically serviceable and offers an extensive serviceable temperature range of 4K (-269.15°C) to +120°C. This phenomenal adhesive fosters outstanding resistance to mechanical and thermal shocks. It offers minimal shrinkage upon cure. KB 10473 FLAO adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical insulation, it also offers lower exotherm, making it ideal for stress free bonding. Part A and Part B are off-white in color. KB 10473 FLAO is widely used in optical, optoelectronic, fiber-optic, electronics and related industries especially where excellent thermal conductivity, cryogenic serviceability and high flexibility are desired. 

 

Packaging : Cans, Pails 

B2B Trade

Price (FOB) Negotiable transportation -
MOQ Negotiable Leadtime Negotiable
Payment Options T/T Shipping time Negotiable

Kohesi Bond

Country / Year Established
India India / 2015
Membership
BIZ
Business type
Manufacturer

7

President
Utsav Shah
Address
209A, Bhagtani Enclave, Sonapur Lane, Off L.B.S. Marg, Bhandup West, Mumbai - 400078
Product Category
Epoxy Adhesives
Year Established
2015
No. of Total Employees
51-100
Company introduction
<p>Kohesi Bond is a pioneer in manufacturing custom engineered adhesives, sealants, coatings, potting and encapsulation compounds. In November 2014, we started prototyping as a part of an interdisciplinary effort with the Institute of Chemical Technology, bringing together a team of technical experts to formulate specialty adhesive systems. Through persistent research, technical know-how and groundbreaking innovation we were able to create new compounds that had truly distinguished properties. In September 2015, we founded Kohesi Bond to further our research and manufacture first-rate, industry-ready products in our state of the art facility.

To deliver reliable solutions, we realised that one size does not fit all. Hence, our focus has been on offering tailor-made products, consistent quality and unparalleled expertise to our customers. We want to keep innovating new products with diverse chemistries that add more value to every application. By researching, formulating and testing each product all under the same roof, we are able to take a holistic approach to manufacturing exclusive adhesives and provide customers with an end-to-end solution. 

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