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Package Dicing Adhesive Tape

Negotiable | Min. Order

Description
Features UVcuringtypePackageDicingtape Improvedbacksidechipping,contaminationbywater HigherAdhesivetapeforPackageDicingApplication Model Name AU120-SC AU170-HC AUP1 AUG2 Structure Base Film Polyolefin Polyolefin Polyolefin PET Adhesive Acryl Acryl Acryl Acryl Thickness(um) Total Base film 120 100 170 150 180 150 155 125 Adhesive 20 20 30 30 Protection Film 38 38 38 38 Physical property Tensile Strength(N/mm2) 15 20 20 120 Elogation(%) 120 800 800 110 Adhesion(gf/25mm) Before UV irradiation 1400 1700 2200 1400 After UV irradiation 15 30 40 10 Application Non-Expandable Expandable Expandable Non-Expandable Note 1)Test Method : JIS Z 0237 / KS A 1107Note 2)The product could be modified by customer's request
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Negotiable | (Min. Order)

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  • 12 AMC Co., Ltd.

    Supplier Activity

    Country South Korea South Korea

    KITA DUNS

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    PRODUCT DESCRIPTION
    COMPANY INFORMATION
    Product Information

    Features

    • UVcuringtypePackageDicingtape
    • Improvedbacksidechipping,contaminationbywater
    • HigherAdhesivetapeforPackageDicingApplication
    Model Name AU120-SC AU170-HC AUP1 AUG2
    Structure Base Film Polyolefin Polyolefin Polyolefin PET
    Adhesive Acryl Acryl Acryl Acryl
    Thickness
    (um)
    Total Base film 120 100 170 150 180 150 155 125
    Adhesive 20 20 30 30
    Protection Film 38 38 38 38
    Physical property Tensile Strength
    (N/mm2)
    15 20 20 120
    Elogation(%) 120 800 800 110
    Adhesion
    (gf/25mm)
    Before UV irradiation 1400 1700 2200 1400
    After UV irradiation 15 30 40 10
    Application Non-Expandable Expandable Expandable Non-Expandable
    Note 1)Test Method : JIS Z 0237 / KS A 1107
    Note 2)The product could be modified by customer's request
    Image
    Company
    AMC Co., Ltd.

    AMC Co., Ltd.

    Country South Korea South Korea

    Supplier Activity

    President
    An, Yong-kuk
    Address
    497 Docheong-ri, Geumwang-eup, Eumseong-gun, Chungcheongbuk-do
    Product Category
    Electronic Products & Components Processing,Other Electronic Components
    Year Established
    1996
    No. of Total Employees
    1-50
    Company introduction

    Established in 1996, AMC Co., Ltd. has been manufacturing and supplying the tape for semiconductor companies all over the world. Our main product is semiconductor tape used in processing the semiconductor wafer for backgrinding and dicing.

    - 2004 Perform SMBA Innovation Mission (Sole)-Completed.
    - 2004 Perform CIE Part & Material Mission( Joint)-Completed.
    - 2005 Perform SMBA Innovation Strategy Mission (Joint) -Completed
    - 2005 Perform CIE Part & Material Innovation Mission (Joint)-Completed
    - 2005 Commission of Specialist of Part & Materials against Korea & Japan FTA
    - 2007 Nominated as Part and Materials Mission by CIE
    - 2009 Perform CIE Part & Material Mission -Completed

    Main Markets
    • Belarus Belarus ,
    • China China ,
    • Malaysia Malaysia ,
    • Taiwan Taiwan ,
    • U.S.A U.S.A

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