MIS Auto Decaper

MIS Auto Decaper


Negotiable Min Order Quantity Unit

Required Quantity
Place of Origin
Payment Terms
Negotiable
Production method
Negotiable
Shipping / Lead Time
Negotiable / Negotiable
Keyword
decap, decapsulation, decapsulator, semiconductor,
Category
Other Machinery & Industry Equipment
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MIS Co., Ltd.

Membership
VIP
Country / Year Established
South Korea South Korea /
Business type
Others
Verified Certificate

15

Product name MIS Auto Decaper Certification -
Category Other Machinery & Industry Equipment Ingredients -
Keyword decap , decapsulation , decapsulator , semiconductor Unit Size -
Brand name - Unit Weigh -
origin Stock -
Supply type - HS code -

Product Information

# Function & Features
 
- All the works necessary for decap are realized through   Auto Decaper.
- The automated robot decapsulation system that has been   developed first in the world
- The functions of milling, etching, heating, acetone cleaning,   drying, ultrasonic cleaning, and vision inspection available.
- Protecting workers from harmful chemicals
- Minimizing damage etching of copper in the case of copper   wired IC
- Minimizing the damage on the ball or the tape at the   bottom of a package
- Fast, safe, and efficient decapsulation
- Protecting workers and equipment through the built-in
  exhaust system
- The functions of checking decap results through enlarged   clear images, saving images, and printing images available.
- Dual heating (MIS-specialized technology)
- More precise, faster, and safer decap possible.
- Easy control through convenient GUI
- Repetitions made simple using recipe files
- Consumable gaskets are unnecessary and very small   amount of etching chemical is used.
- Expanded decap possibility for various sizes and patterns   of packages
- Minimal maintenance and repair costs, and long lifecycles

B2B Trade

Price (FOB) Negotiable transportation -
MOQ Negotiable Leadtime Negotiable
Payment Options Negotiable Shipping time Negotiable

MIS Co., Ltd.

Country / Year Established
South Korea South Korea /
Membership
VIP
Business type
Others

15

President
SHIN KYEONG WOOK
Address
#709, Daehyun Techno World 174, Ojeon-dong, Uiwang-si, Gyeonggi-do
Product Category
Plastic Product Making Machinery
No. of Total Employees
over 2000
Company introduction
MIS Co., Ltd. is a Manufacturing Company producing Semiconductor tester machines. We developed a Encapsulation Machine, Which removes automatically EMC(Epoxy Molding Compound) of Packaged semiconductor chips without any damage of wire bonds. When the examined packaged chip is judged to have defects, the Encapsulation process determines the defects in a semiconductor whether it was blemished in the packaging process or the wafer process. Our Decipher Machines makes it possible to open the packaged chip quickly and it automates the whole process of opening the failed chip. - Computer GUI All the functions and operations are controlled by Graphic User interface using Computer. - Accuracy 0.01mm Milling Accuracy of the milling depth. MIS auto Decipher detects the height automatically using sensor. MIS Auto Decipher can test various sizes of the chips ranged 1mm x 1mm ~ 50mm x 50mm. - Convenient Operation User can easily find and use a best automatic process using recipe files stored in a database. User can easily create new recipe and edit it. Milling, Chemical process, Cleaning, Inspection, Storing of digital images, Checking of Machine settings or errors can be easily executed by GUI. - Safety MIS Auto Decipher secures the safety from the acid gas evaporation using gas exhauster and it use the minimum chemicals. - Dispensing MIS Auto Decipher has a special pump, which can inject Fuming Nitric Acid, Fuming Sulfuric Acid or Sulfuric Acid by 0.005cc(Min.) to remove the Epoxy Molding Compound of a chip. - Various Handling IC MIS Auto Decipher uses various chemical dosing methods and this makes it possible to decamp various package types such as BGA, DIP, QFP, CSP, TSOP, PBGA, Most of package types. - Speedy process MIS Auto Decipher can remove the EMC of various chips faster than before. Usually BGA type takes tome not more than 20 minutes and NON-BGA type can be executed within 15 minutes. - No Need of Gasket MIS Auto Decip
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