MIS Co., Ltd.
Slurry Nozzle Gadget for CMP(Chemical mechanical polishing)
MIS Auto Decaper
MIS Wet Etch
< A NEWLY IMPROVED SLURRY REDUCTION NOZZLE GADGET IN
THE POLISHING PROCESS OF THE SEMICONDUCTOR >
1) COST SAVED FOR THE CUSTOMERS SLURRY USAGE REDUCED
( Cost reduction effectiveness : 30 % proven )
2) Slurry goes to spread out widely and
thinly on the platen.
( No more waste for the slurry excessively. )
3) Pressure is all the same on each hole of nozzle.
(Slurry comes out all the same flow rate for the multiple hole nozzle. )
4) Prevention of the slurry solidified.
( Easy to clean for the Nozzle )
5) Reliable reference tested
( Major companies has already tested it for the effectiveness. )
MIS Co., Ltd.
SHIN KYEONG WOOK
#709, Daehyun Techno World 174, Ojeon-dong, Uiwang-si, Gyeonggi-do
Plastic Product Making Machinery
No. of Total Employees
MIS Co., Ltd. is a Manufacturing Company producing Semiconductor tester machines.
We developed a Encapsulation Machine, Which removes automatically EMC(Epoxy Molding Compound) of Packaged semiconductor chips without any damage of wire bonds.
When the examined packaged chip is judged to have defects, the Encapsulation process determines the defects in a semiconductor whether it was blemished in the packaging process or the wafer process.
Our Decipher Machines makes it possible to open the packaged chip quickly and it automates the whole process of opening the failed chip.
- Computer GUI
All the functions and operations are controlled by Graphic User interface using Computer.
0.01mm Milling Accuracy of the milling depth. MIS auto Decipher detects the height automatically using sensor.
MIS Auto Decipher can test various sizes of the chips ranged 1mm x 1mm ~ 50mm x 50mm.
- Convenient Operation
User can easily find and use a best automatic process using recipe files stored in a database. User can easily create new recipe and edit it.
Milling, Chemical process, Cleaning, Inspection, Storing of digital images, Checking of Machine settings or errors can be easily executed by GUI.
MIS Auto Decipher secures the safety from the acid gas evaporation using gas exhauster and it use the minimum chemicals.
MIS Auto Decipher has a special pump, which can inject Fuming Nitric Acid, Fuming Sulfuric Acid or Sulfuric Acid by 0.005cc(Min.) to remove the Epoxy Molding Compound of a chip.
- Various Handling IC
MIS Auto Decipher uses various chemical dosing methods and this makes it possible to decamp various package types such as BGA, DIP, QFP, CSP, TSOP, PBGA, Most of package types.
- Speedy process
MIS Auto Decipher can remove the EMC of various chips faster than before. Usually BGA type takes tome not more than 20 minutes and NON-BGA type can be executed within 15 minutes.
- No Need of Gasket
MIS Auto Decip
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