Slurry Nozzle Gadget for CMP(Chemical mechanical polishing)

Negotiable | Min Order Quantity Unit
Required
Quantity
Place of Origin
South Korea
Brand name
Slurry Nozzle
Payment Terms
Negotiable
Production
method
Negotiable
Shipping /
Lead Time
Negotiable / Negotiable
Keyword
nozzle, slurry, cmp, reduction,
Category
Chemical Machinery Equipment , Other Chemicals , Machining Services , Other Inorganic Chemicals

14 MIS Co., Ltd.

Supplier Activity

tradeKorea provides seller activity to buyers throu gh seller evaluation and measurement according to each item.

  • Country

    South Korea South Korea

    Verified Certificate

    • KITA
    • DUNS
    Product name Slurry Nozzle Gadget for CMP(Chemical mechanical polishing) Certification -
    Category Chemical Machinery Equipment
    Other Chemicals
    Machining Services
    Other Inorganic Chemicals
    Ingredients -
    Keyword nozzle , slurry , cmp , reduction Unit Size -
    Brand name Slurry Nozzle Unit Weigh -
    origin South Korea Stock -
    Supply type - HS code -
    Product Information

     

     

    < A NEWLY IMPROVED SLURRY REDUCTION NOZZLE GADGET IN 

       THE POLISHING PROCESS OF THE SEMICONDUCTOR > 

     

    1) COST SAVED FOR THE CUSTOMERS SLURRY USAGE REDUCED

        ( Cost reduction effectiveness : 30 % proven ) 

     

    2) Slurry goes to spread out widely and thinly on the platen.

        ( No more waste for the slurry excessively. ) 

     

    3) Pressure is all the same on each hole of nozzle.

       (Slurry comes out all the same flow rate for the multiple hole nozzle. ) 

     

     

     

    4) Prevention of the slurry solidified.

       ( Easy to clean for the Nozzle ) 

     

     

    5) Reliable reference tested

       ( Major companies has already tested it for the effectiveness. ) 

     

     

     

     

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    B2B Trade
    Price (FOB) Negotiable transportation -
    MOQ Negotiable Leadtime Negotiable
    Payment Options Negotiable Shipping time Negotiable

    14 MIS Co., Ltd.

    • Country

      South Korea South Korea
    • Supplier Activity

    • President

      SHIN KYEONG WOOK

    • Address

      #709, Daehyun Techno World 174, Ojeon-dong, Uiwang-si, Gyeonggi-do

    • Product Category

      Plastic Product Making Machinery

    • No. of Total Employees

      over 2000

    • Company introduction

      MIS Co., Ltd. is a Manufacturing Company producing Semiconductor tester machines. We developed a Encapsulation Machine, Which removes automatically EMC(Epoxy Molding Compound) of Packaged semiconductor chips without any damage of wire bonds. When the examined packaged chip is judged to have defects, the Encapsulation process determines the defects in a semiconductor whether it was blemished in the packaging process or the wafer process. Our Decipher Machines makes it possible to open the packaged chip quickly and it automates the whole process of opening the failed chip. - Computer GUI All the functions and operations are controlled by Graphic User interface using Computer. - Accuracy 0.01mm Milling Accuracy of the milling depth. MIS auto Decipher detects the height automatically using sensor. MIS Auto Decipher can test various sizes of the chips ranged 1mm x 1mm ~ 50mm x 50mm. - Convenient Operation User can easily find and use a best automatic process using recipe files stored in a database. User can easily create new recipe and edit it. Milling, Chemical process, Cleaning, Inspection, Storing of digital images, Checking of Machine settings or errors can be easily executed by GUI. - Safety MIS Auto Decipher secures the safety from the acid gas evaporation using gas exhauster and it use the minimum chemicals. - Dispensing MIS Auto Decipher has a special pump, which can inject Fuming Nitric Acid, Fuming Sulfuric Acid or Sulfuric Acid by 0.005cc(Min.) to remove the Epoxy Molding Compound of a chip. - Various Handling IC MIS Auto Decipher uses various chemical dosing methods and this makes it possible to decamp various package types such as BGA, DIP, QFP, CSP, TSOP, PBGA, Most of package types. - Speedy process MIS Auto Decipher can remove the EMC of various chips faster than before. Usually BGA type takes tome not more than 20 minutes and NON-BGA type can be executed within 15 minutes. - No Need of Gasket MIS Auto Decip

    • Main Product
      • Slurry Nozzle Gadget for CMP_Chemical mechanical polishing_

        Slurry Nozzle Gadget for CMP(Chemical mechanical polishing)


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        MIS Auto Decaper


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