SPUTTERING (Batch Type)
Negotiable Min Order Quantity Unit
- Required Quantity
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- Place of Origin
- Payment Terms
- Negotiable
- Production method
- Negotiable
- Shipping / Lead Time
- Negotiable / Negotiable
- Keyword
- Category
- Vacuum Equipment & Parts
Apply a video call to the Supplier
Univac Co., Ltd.
- Country / Year Established
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South Korea
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- Business type
- Others
- Verified Certificate
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16
| Product name | SPUTTERING (Batch Type) | Certification | - |
|---|---|---|---|
| Category | Vacuum Equipment & Parts | Ingredients | - |
| Keyword | - | Unit Size | - |
| Brand name | - | Unit Weigh | - |
| origin | Stock | - | |
| Supply type | - | HS code | - |
Product Information
SPUTTERING (Batch Type)
Pursuit of the Best Quality
"Sputtering" is a vacuum process used to deposit very thin films on substrates for a wide variety of commercial and scientific purposes. It is performed by applying a high voltage across a low-pressure gas (usually argon at about 5 military) to create a "plasma, "which consists of electrons and gas ions in a high-energy state. During sputtering, energized plasma ions strike a "target", composed of the desired coating material, and cause atoms from that target to be Ejected with enough to travel to, and bond with, the substrate.
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Features
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Benefits
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This sputtering system is equipped with 3 targets, also known as cathodes, and 1 linear type DC Ion Source for pretreatment. These parts are located at the left and right sides of the machine on pairs. In order to improve production yield, it consist of Univac’s large capacity oil diffusion pumps with faster pumping time and 2 batch type doors with revolution-rotation substrate holders. Effective automatic system control enables easy coating process and excellent products. Ar is the primary gas used to sputter atoms from the targets and O2 is used for reactive sputtering to adjust stoechiometry of oxides if needed. |
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Application of an axial magnetic field increase the path length of the electron because electrons execute longer helical path orbits before they reach the anode. The magnetic field helps the electrons to stay away from the walls of the sputtering chamber, thereby reducing the losses of electrons due to recombination process at the walls. In a combined electric and magnetic fields, the electrons remain in a trap near the target, so that they increase their ionizing effect. Magnetron configurations eliminate the path of the electrons going to the walls or to the substrate. Magnetrons, the sputtering sources with magnetic confinement of electrons, greatly enhance the capability of the sputtering process by increasing ionization process. Magnetron sputtering achieves high deposition rates. |
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Benefits
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B2B Trade
| Price (FOB) | Negotiable | transportation | - |
|---|---|---|---|
| MOQ | Negotiable | Leadtime | Negotiable |
| Payment Options | Negotiable | Shipping time | Negotiable |
- President
- Heung-sang Yoo
- Address
- #335, Mangdung-ri, Juchon-myeon,, Gimhae-si,Gyeongsangnam-do,
- Product Category
- Other Machinery & Industry Equipment
- Company introduction
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Univac Ltd. was founded in1987 as Union Vacuum Technology, and since then developed into the specialized vacuum equipment manufacturer.
The continuous and arduous endeavors under the motto "Pursuit of the Best Quality" has brought about the customers' appreciation of the excellency of the quality and enabled us to settle down the best vacuum applied equipment manufacturer.
In order to efficiently meet with the potentially increasing trend of work orders from the 21st century world markets, Univac Ltd. are prepared with the massive production through the enlarged and augmented production facilities.
All the members of Univac Limited will strive to do our best for the supply of products which satisfy the customers demanding requirements and needs.
We look forward to the everlasting patronages from all of you.
Thank you.
- Main Markets
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China
India
Malaysia
Taiwan
Thailand
- Main Product
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