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- South Korea / 2015
Printed Circuit board, Printed Circuit Board ASSEMBLY
- ◾ Price: Negotiable
- ◾ MOQ: Negotiable
Printed Circuit board, Printed Circuit Board ASSEMBLY
- ◾ Price: Negotiable
- ◾ MOQ: Negotiable
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Printed circuit board ans Assembly
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Required Quantity
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Brand name-
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Shipping / Lead TimeNegotiable / Negotiable
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Keyword
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Category
Specifications
| Size | - | Weight | - | Stock | 10,000 Pieces |
|---|---|---|---|---|---|
| Country of Origin | South Korea | ||||
| Production method | Available | ||||
Trade Terms
| Payment Terms | T/T | ||||
|---|---|---|---|---|---|
| Price(FOB) | Negotiable | MOQ | Negotiable | ||
| Transportation | Air Transportation | ||||
| Lead time | Negotiable | Shipping time | Negotiable | ||
Company
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Country / Year Established
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Membership
- VIP
Business typeManufacturer
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Verified Certificate
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7
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7
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Main Export Markets
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Canada
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Germany
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Japan
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Malaysia
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USA
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Product Description
Product Catalog / Brochure / Spec Sheet
1.PCB Business
SINGLE SIDED PCB, DOUBLE SIDED PCB, MULTI LAYER PCB
SINGLE SIDED PCB, DOUBLE SIDED PCB, MULTI LAYER PCB
2. Manufacturing capacity
Max panel size 507*607mm
Material XPC,PHENOL,CEM,FR-1, FR-4
Copper(μ m) 18, 35, 70
Thickness 0.8 ~ 3.21
Ink UV , PSR
Surface treatment FLUX, HASL, AU-PTH
Min Hole Size(Normal, Φ) 0.3
Max panel size 507*607mm
Material XPC,PHENOL,CEM,FR-1, FR-4
Copper(μ m) 18, 35, 70
Thickness 0.8 ~ 3.21
Ink UV , PSR
Surface treatment FLUX, HASL, AU-PTH
Min Hole Size(Normal, Φ) 0.3
3. Equipment
- CAM CAM MASTER, CAM 350, LASER PLOTTER, I-MARK,RIP, DEVELOPING MACHINE
- CUTTING CUTTING MACHINE
- MASS LAM HOT PRESS, COOL PRESS, AOI
-DRILL ADVANCE, AUTO STACKING MACHINE
- COPPER PLATING AUTO PANNEL PLATING LINE,
- D/F BUFFER, LAMINATOR,AUTO LAMINATOR, EXPOSE M/C, DEVELOPING,ETCHING,STRIPPING
- CIRCUIT INSPECTION AUTO OPTICAL INSPECTION, VIDEO RESPONSE SYSTEM
- PSR CLEAN M/C, SEMI AUTO PSR PRINT M/C, AUTO SPRAY TYPE PSR LINE, WICKET SEMI CURE
- MARKING SEMI AUTO PRINT M/C, TUNNEL TYPE DRYER, BOX TYPE DRYER
- OSP(FLUX) ORGANIC SOLDERABILITY PRESERVATIVE
- HASL HORIZONTAL TYPE M/C
- ELECTROLESS GOLD PLATING AU, NI PLATING LINE
- ROUTER ROUTER M/C
- PRESS PUNCHING PUNCHING M/C
- V-CUT V-CUT M/C
- BBT SEMI AUTO TESTER, AUTO TESTER, UNIVERSAL TYPE
- FINAL INSPECTION AUTO FINAL INSPECTION
- PACKING VACUUM PACKING M/C
- CAM CAM MASTER, CAM 350, LASER PLOTTER, I-MARK,RIP, DEVELOPING MACHINE
- CUTTING CUTTING MACHINE
- MASS LAM HOT PRESS, COOL PRESS, AOI
-DRILL ADVANCE, AUTO STACKING MACHINE
- COPPER PLATING AUTO PANNEL PLATING LINE,
- D/F BUFFER, LAMINATOR,AUTO LAMINATOR, EXPOSE M/C, DEVELOPING,ETCHING,STRIPPING
- CIRCUIT INSPECTION AUTO OPTICAL INSPECTION, VIDEO RESPONSE SYSTEM
- PSR CLEAN M/C, SEMI AUTO PSR PRINT M/C, AUTO SPRAY TYPE PSR LINE, WICKET SEMI CURE
- MARKING SEMI AUTO PRINT M/C, TUNNEL TYPE DRYER, BOX TYPE DRYER
- OSP(FLUX) ORGANIC SOLDERABILITY PRESERVATIVE
- HASL HORIZONTAL TYPE M/C
- ELECTROLESS GOLD PLATING AU, NI PLATING LINE
- ROUTER ROUTER M/C
- PRESS PUNCHING PUNCHING M/C
- V-CUT V-CUT M/C
- BBT SEMI AUTO TESTER, AUTO TESTER, UNIVERSAL TYPE
- FINAL INSPECTION AUTO FINAL INSPECTION
- PACKING VACUUM PACKING M/C
4.Client
SAMSUNG, LG, COWAY
1. Manufacturing capacity
Max panel size 507*607mm
Material XPC,PHENOL,CEM,FR-1, FR-4
Copper(μ m) 18, 35, 70
Thickness 0.8 ~ 3.21
Ink UV , PSR
Surface treatment FLUX, HASL, AU-PTH
Min Hole Size(Normal, Φ) 0.3
Max panel size 507*607mm
Material XPC,PHENOL,CEM,FR-1, FR-4
Copper(μ m) 18, 35, 70
Thickness 0.8 ~ 3.21
Ink UV , PSR
Surface treatment FLUX, HASL, AU-PTH
Min Hole Size(Normal, Φ) 0.3
2. Equipment
- CAM CAM MASTER, CAM 350, LASER PLOTTER, I-MARK,RIP, DEVELOPING MACHINE
- CUTTING CUTTING MACHINE
- MASS LAM HOT PRESS, COOL PRESS, AOI
-DRILL ADVANCE, AUTO STACKING MACHINE
- COPPER PLATING AUTO PANNEL PLATING LINE,
- D/F BUFFER, LAMINATOR,AUTO LAMINATOR, EXPOSE M/C, DEVELOPING,ETCHING,STRIPPING
- CIRCUIT INSPECTION AUTO OPTICAL INSPECTION, VIDEO RESPONSE SYSTEM
- PSR CLEAN M/C, SEMI AUTO PSR PRINT M/C, AUTO SPRAY TYPE PSR LINE, WICKET SEMI CURE
- MARKING SEMI AUTO PRINT M/C, TUNNEL TYPE DRYER, BOX TYPE DRYER
- OSP(FLUX) ORGANIC SOLDERABILITY PRESERVATIVE
- HASL HORIZONTAL TYPE M/C
- ELECTROLESS GOLD PLATING AU, NI PLATING LINE
- ROUTER ROUTER M/C
- PRESS PUNCHING PUNCHING M/C
- V-CUT V-CUT M/C
- BBT SEMI AUTO TESTER, AUTO TESTER, UNIVERSAL TYPE
- FINAL INSPECTION AUTO FINAL INSPECTION
- PACKING VACUUM PACKING M/C
- CAM CAM MASTER, CAM 350, LASER PLOTTER, I-MARK,RIP, DEVELOPING MACHINE
- CUTTING CUTTING MACHINE
- MASS LAM HOT PRESS, COOL PRESS, AOI
-DRILL ADVANCE, AUTO STACKING MACHINE
- COPPER PLATING AUTO PANNEL PLATING LINE,
- D/F BUFFER, LAMINATOR,AUTO LAMINATOR, EXPOSE M/C, DEVELOPING,ETCHING,STRIPPING
- CIRCUIT INSPECTION AUTO OPTICAL INSPECTION, VIDEO RESPONSE SYSTEM
- PSR CLEAN M/C, SEMI AUTO PSR PRINT M/C, AUTO SPRAY TYPE PSR LINE, WICKET SEMI CURE
- MARKING SEMI AUTO PRINT M/C, TUNNEL TYPE DRYER, BOX TYPE DRYER
- OSP(FLUX) ORGANIC SOLDERABILITY PRESERVATIVE
- HASL HORIZONTAL TYPE M/C
- ELECTROLESS GOLD PLATING AU, NI PLATING LINE
- ROUTER ROUTER M/C
- PRESS PUNCHING PUNCHING M/C
- V-CUT V-CUT M/C
- BBT SEMI AUTO TESTER, AUTO TESTER, UNIVERSAL TYPE
- FINAL INSPECTION AUTO FINAL INSPECTION
- PACKING VACUUM PACKING M/C
Max panel size 507*607mm
Material XPC,PHENOL,CEM,FR-1, FR-4
Copper(μ m) 18, 35, 70
Thickness 0.8 ~ 3.21
Ink UV , PSR
Surface treatment FLUX, HASL, AU-PTH
Min Hole Size(Normal, Φ) 0.3
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