Cluster system for Oxide and Metal sputtering
Negotiable Min Order Quantity Unit
- Required Quantity
-
- Place of Origin
- Payment Terms
- Negotiable
- Production method
- Negotiable
- Shipping / Lead Time
- Negotiable / Negotiable
- Keyword
- pvd, sputter, magnetron sputter
- Category
- Other Machinery & Industry Equipment
Apply a video call to the Supplier
A-Tech System, Inc.
- Country / Year Established
-
South Korea
/
- Business type
- Others
- Verified Certificate
-
12
| Product name | Cluster system for Oxide and Metal sputtering | Certification | - |
|---|---|---|---|
| Category | Other Machinery & Industry Equipment | Ingredients | - |
| Keyword | pvd , sputter , magnetron sputter | Unit Size | - |
| Brand name | - | Unit Weigh | - |
| origin | Stock | - | |
| Supply type | - | HS code | - |
Product Information
Metal, ceramic, and alloy depositions for R&D in OLED fields.
Special Features
Cluster sputtering system for TCO deposition with two sputtering chambers and one glove box.
Robot transfer chamber between chambers and glove box.
Cassette loading type with glass holder.
Three tiltable 8" sputter guns and extra sputter gun ports in each chamber.
Available in multilayer deposition as well as co-deposition.
Automatic control in substrate rotation and substrate to cathode distance.
Precision mask aligner with laser focusing.
Substrate temperature uniformity : <±2% over 200x200 glass.
System operation by PLC-based PC control.
Specifications
Glass Capacity : 5 × 200(mm3)
Dimension : 3,500L × 2,400H × 3,300W(mm3)
Power : AC 220V, three phase for main
RF 3,000W 2set for sputtering
DC 5,000W 2set for sputtering
Heater : SiC coated graphite (Max. 600°C)
Gas : Ar/N2/O2/H2/C2H2
Pump : rotary(1,000l/min) & TMP(400l/s) for transfer chamber
turbo(2,400l/s, 2set) & dry pump(1,900l/min 2 set) for main chamber
B2B Trade
| Price (FOB) | Negotiable | transportation | - |
|---|---|---|---|
| MOQ | Negotiable | Leadtime | Negotiable |
| Payment Options | Negotiable | Shipping time | Negotiable |
- President
- Cho, Young Sang
- Address
- 175-25, Cheongcheon-Dong 2, Bupyeong-Gu, Incheon, 403-853, Rep. Korea
- Product Category
- Machinery & Parts
- Company introduction
-
Developed itmes
- Ion beam source
- Arc source
- Filtered cathodic vacuum arc system and process
- LPCVD for nanotube synthesis
- Silica PECVD system
- UHV(Ultra High Vacuum) sputtering system
- Silica TCP (Transformer Coupled Plasma) etcher
- UHV-sputter system for ferromagnetic multilayers
- Vacuum arc system for nitrides deposition
- In-line system of vacuum arc deposition for protecting PDP
electrodes
- High vacuum test system for a flat light source evaluation
- Multifunctional standard sputtering system for R&D
- NPPN(New Post Plasma Nitriding) System
- Sputter for polygon mirror applicable to laser printer
- Production scale of arc ion plating (AIP) system
- Ion beam sputter for precision optics
- Production scale of AIP and NPPN systems
- Ion plating system for various coloration
- Pilot scale of arc discharge equipment for CNT transparent electrode
sputter web coater for flexible display research
- Sputter system for ophthalmic
- Polycrystalline silicon ingot growing equipment
- PECVD system for anti-reflective coatings on solar cell
- PECVD system for graphene deposition
- Al plasma nitriding equipment for mass production with KAITECH
- Equipment of carbon nanotube using electrical arc discharge method
- Graphene PECVD-PVD Cluster equipment
- Main Product
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