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Back Grind Adhesive Tape

Negotiable / | Min Order Quantity Unit

Required Quantity

Place of Origin
Payment Terms
Negotiable
Production method
Negotiable
Shipping / Lead Time
Negotiable / Negotiable
Keyword
Category
Packing Sealing Adhesive Tapes

13 AMC Co., Ltd.

Supplier Activity

tradeKorea provides seller activity to buyers through seller evaluation and measurement according to each item.

Country South Korea South Korea

KITA DUNS

PRODUCT DESCRIPTION
COMPANY INFORMATION
Product name Back Grind Adhesive Tape Certification -
category Packing Sealing Adhesive Tapes Ingredients -
Keyword - Unit Size -
Brand name - Unit Weigh -
origin Stock -
Supply type - HS code -
Product Information

Features

  • ImprovingTTVValue
  • PreventDustandWaferPenetration
  • AbsorbingMechanicalstress
Model Name AP130-SC APB1 APB7 AU130-SC
Structure Base Film Polyolefin Polyolefin EVA Polyolefin
Adhesive Acryl Acryl Acryl Acryl
Thickness
(um)
Total Base film 130 110 130 110 240 200 130 110
Adhesive 20 20 40 20
Protection Film 38 38 38 38
Physical property Tensile Strength
(N/mm2)
20 20 25 20
Elogation(%) 800 800 900 900
Adhesion
(gf/25mm)
Before UV irradiation 150 100 400 330
After UV irradiation       30
Application Non-UV type Non-UV type Non-UV type UV type
Note 1) Test Method : JIS Z 0237 / KS A 1107
Note 2) The product could be modified by customer's request
B2B Trade
Price (FOB) Negotiable transportation -
MOQ Negotiable Leadtime Negotiable
Payment Options Negotiable Shipping time Negotiable
Company
AMC Co., Ltd.

AMC Co., Ltd.

Country South Korea South Korea

Supplier Activity

President
An, Yong-kuk
Address
497 Docheong-ri, Geumwang-eup, Eumseong-gun, Chungcheongbuk-do
Product Category
Electronic Products & Components Processing,Other Electronic Components
Year Established
1996
No. of Total Employees
1-50
Company introduction

Established in 1996, AMC Co., Ltd. has been manufacturing and supplying the tape for semiconductor companies all over the world. Our main product is semiconductor tape used in processing the semiconductor wafer for backgrinding and dicing.

- 2004 Perform SMBA Innovation Mission (Sole)-Completed.
- 2004 Perform CIE Part & Material Mission( Joint)-Completed.
- 2005 Perform SMBA Innovation Strategy Mission (Joint) -Completed
- 2005 Perform CIE Part & Material Innovation Mission (Joint)-Completed
- 2005 Commission of Specialist of Part & Materials against Korea & Japan FTA
- 2007 Nominated as Part and Materials Mission by CIE
- 2009 Perform CIE Part & Material Mission -Completed

Main Markets
  • Belarus Belarus ,
  • China China ,
  • Malaysia Malaysia ,
  • Taiwan Taiwan ,
  • U.S.A U.S.A

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