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Dicing Adhesive Tape

Negotiable | Min. Order

Description
Features UVcuringtypeWaferDicingtape Expandabletype Improvedbacksidechipping,contamination Model Name AUD1 AUD2 AUF1 AU105-HA Structure Base Film PVC PVC Polyolefin Polyolefin Adhesive Acryl Acryl Acryl Acryl Thickness(um) Total Base film 90 80 90 80 90 80 105 100 Adhesive 10 10 10 5 Protection Film 38 38 38 38 Physical property Tensile Strength(N/mm2) 30 30 20 20 Elogation(%) 400 400 800 800 Adhesion(gf/25mm) Before UV irradiation 80 260 500 500 After UV irradiation 10 15 10 10 Application Expandable Expandable Expandable Expandable Note 1)Test Method : JIS Z 0237 / KS A 1107Note 2)The product could be modified by customer's request
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Negotiable | (Min. Order)

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  • 12 AMC Co., Ltd.

    Supplier Activity

    Country South Korea South Korea

    KITA DUNS

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    PRODUCT DESCRIPTION
    COMPANY INFORMATION
    Product Information

    Features

    • UVcuringtypeWaferDicingtape
    • Expandabletype
    • Improvedbacksidechipping,contamination
    Model Name AUD1 AUD2 AUF1 AU105-HA
    Structure Base Film PVC PVC Polyolefin Polyolefin
    Adhesive Acryl Acryl Acryl Acryl
    Thickness
    (um)
    Total Base film 90 80 90 80 90 80 105 100
    Adhesive 10 10 10 5
    Protection Film 38 38 38 38
    Physical property Tensile Strength
    (N/mm2)
    30 30 20 20
    Elogation(%) 400 400 800 800
    Adhesion
    (gf/25mm)
    Before UV irradiation 80 260 500 500
    After UV irradiation 10 15 10 10
    Application Expandable Expandable Expandable Expandable
    Note 1)Test Method : JIS Z 0237 / KS A 1107
    Note 2)The product could be modified by customer's request
    Image
    Company
    AMC Co., Ltd.

    AMC Co., Ltd.

    Country South Korea South Korea

    Supplier Activity

    President
    An, Yong-kuk
    Address
    497 Docheong-ri, Geumwang-eup, Eumseong-gun, Chungcheongbuk-do
    Product Category
    Electronic Products & Components Processing,Other Electronic Components
    Year Established
    1996
    No. of Total Employees
    1-50
    Company introduction

    Established in 1996, AMC Co., Ltd. has been manufacturing and supplying the tape for semiconductor companies all over the world. Our main product is semiconductor tape used in processing the semiconductor wafer for backgrinding and dicing.

    - 2004 Perform SMBA Innovation Mission (Sole)-Completed.
    - 2004 Perform CIE Part & Material Mission( Joint)-Completed.
    - 2005 Perform SMBA Innovation Strategy Mission (Joint) -Completed
    - 2005 Perform CIE Part & Material Innovation Mission (Joint)-Completed
    - 2005 Commission of Specialist of Part & Materials against Korea & Japan FTA
    - 2007 Nominated as Part and Materials Mission by CIE
    - 2009 Perform CIE Part & Material Mission -Completed

    Main Markets
    • Belarus Belarus ,
    • China China ,
    • Malaysia Malaysia ,
    • Taiwan Taiwan ,
    • U.S.A U.S.A

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