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Dicing Adhesive Tape

Negotiable / | Min Order Quantity Unit

Required Quantity

Place of Origin
Payment Terms
Negotiable
Production method
Negotiable
Shipping / Lead Time
Negotiable / Negotiable
Keyword
Category
Packing Sealing Adhesive Tapes

13 AMC Co., Ltd.

Supplier Activity

tradeKorea provides seller activity to buyers through seller evaluation and measurement according to each item.

Country South Korea South Korea

KITA DUNS

PRODUCT DESCRIPTION
COMPANY INFORMATION
Product name Dicing Adhesive Tape Certification -
category Packing Sealing Adhesive Tapes Ingredients -
Keyword - Unit Size -
Brand name - Unit Weigh -
origin Stock -
Supply type - HS code -
Product Information

Features

  • UVcuringtypeWaferDicingtape
  • Expandabletype
  • Improvedbacksidechipping,contamination
Model Name AUD1 AUD2 AUF1 AU105-HA
Structure Base Film PVC PVC Polyolefin Polyolefin
Adhesive Acryl Acryl Acryl Acryl
Thickness
(um)
Total Base film 90 80 90 80 90 80 105 100
Adhesive 10 10 10 5
Protection Film 38 38 38 38
Physical property Tensile Strength
(N/mm2)
30 30 20 20
Elogation(%) 400 400 800 800
Adhesion
(gf/25mm)
Before UV irradiation 80 260 500 500
After UV irradiation 10 15 10 10
Application Expandable Expandable Expandable Expandable
Note 1)Test Method : JIS Z 0237 / KS A 1107
Note 2)The product could be modified by customer's request
B2B Trade
Price (FOB) Negotiable transportation -
MOQ Negotiable Leadtime Negotiable
Payment Options Negotiable Shipping time Negotiable
Company
AMC Co., Ltd.

AMC Co., Ltd.

Country South Korea South Korea

Supplier Activity

President
An, Yong-kuk
Address
497 Docheong-ri, Geumwang-eup, Eumseong-gun, Chungcheongbuk-do
Product Category
Electronic Products & Components Processing,Other Electronic Components
Year Established
1996
No. of Total Employees
1-50
Company introduction

Established in 1996, AMC Co., Ltd. has been manufacturing and supplying the tape for semiconductor companies all over the world. Our main product is semiconductor tape used in processing the semiconductor wafer for backgrinding and dicing.

- 2004 Perform SMBA Innovation Mission (Sole)-Completed.
- 2004 Perform CIE Part & Material Mission( Joint)-Completed.
- 2005 Perform SMBA Innovation Strategy Mission (Joint) -Completed
- 2005 Perform CIE Part & Material Innovation Mission (Joint)-Completed
- 2005 Commission of Specialist of Part & Materials against Korea & Japan FTA
- 2007 Nominated as Part and Materials Mission by CIE
- 2009 Perform CIE Part & Material Mission -Completed

Main Markets
  • Belarus Belarus ,
  • China China ,
  • Malaysia Malaysia ,
  • Taiwan Taiwan ,
  • U.S.A U.S.A

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